Manufacturing

Manufacturing

Our state of the art Printed Circuit Board (PCB) assembly equipment, manufacturing systems and experienced staff are able to provide individual or combined capabilities to successfully bring your product to market. As a customer driven company we are continuously evaluating advanced technologies against our customer requirements in order to keep each customer ahead of their competition.


Lower Production Costs

Our project managers review and communicate optimal production options.

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Increase Yield

The success of your yield begins with our professional design and layout review team.

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On Time and in Budget

100% On Time Delivery while maintaining a 99.96% or greater Quality Assurance.

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Materials Management

Our ERP system and direct link to key suppliers allows for effective and timely material control. The system allows real time, turnkey, supply chain solutions based on customer requirements and total cost. Combined with supplier partnerships the integrated system provides fast and flexible supply chain management and material solutions.

Assembly Options

SMT Production Assembly: IES’s PCB assembly capabilities extend from thru-hole to SMT fine pitch, BGA, µBGA, and leadless device mounting.
Through-Hole Production Assembly: IES provides expert manual pin-through-hole assembly to meet your production requirements with precision and reliability.
Wire and Cable Assembly: IES can provide certain wire assembly and cable fabrication services for our customers or engage our wire and cable suppliers.

Inspection Processes

3D Solder Paste Inspection (SPI): Inspection of solder paste deposits inline of solder-paste printing process to provide fast, reliable, and accurate assembly.
3D X-Ray Inspection: Inspection for process optimization and anomaly detection to provide fast, reliable, and accurate assembly.
3D Automatic Optical Inspection (AOI): IES has enhanced its QA inspection capabilities with the addition of Automatic Optical Inspection (AOI) to augment visual inspection to ensure process optimization and control.

Box Build and System Integration

We provide vertically integrated, turnkey solutions that offer a seamless extension of our customer’s operations. We offer sub-system and complete system assembly services to our customers. We can provide complete box build services, complete with software configuration and final test to specifications.

Quality Assurance

From purchasing through production IES's team members are focused on the accuracy of the systems and the quality of products produced for every customer. Assemblies conform to the requirements of IPC-A-610 Class III and J-STD-001 if so required and design capable.

Other Services

At IES we are committed to deliver first class quality products and services to our customers through innovative processes, continuous improvement, compliance and the dedication of our employees.

  • 3D Printing

    3D Printing services for both prototyping and production runs using Essentium's high-temp printing solutions.


    Materials we offer:


    High-Temp Nylon

    PEKK

    PA-CF

    ESD-Safe version of many common materials

  • Burn In

    Static or Dynamic thermal cycling of components and assemblies.

  • Parts Programming

    We can program a part on-site or work with a supply chain provider.

  • Conformal Coating

    Conformal Coating & Potting


    When there is a need to protect circuit assemblies from harsh environments and strengthen connections, conformal coating and potting are methods to cover those sensitive electronics and cable harnesses for long-term use in the field. IES has coating and potting capabilities for circuit and harness assemblies. Silicone, acrylic, and polyurethane based coating and potting materials can be used depending on customer requirements.


    We use a wide variety of processes to cover the circuit assembly in only the areas requested by our customers. Conformal coating can be brushed, masked, dipped, and sprayed to any thickness required.


                   


    Environmental Circuit Protection Methods


    Conformal Coating


    Potting (Cold)


    Encapsulation


    Materials


    Silicone


    Acrylic


    Polyurethane


    2-part Epoxies


    Single-Sided


    Application


    Manual Dispensing


    Air and Mechanical Assisted Dispensing


    Selective Area


    Pour Filing

  • Prototyping & Pilot Builds

     From a single piece to your volume requirements IES can build prototypes quickly.

  • Testing

    PCBA, Functional and System test can be custom designed for each customer and provide information for continuous improvement.

  • Traceability

    Traceability coverage can begin with component to PCB board or extend throughout the production lifecycle to offer coverage for: materials, machine, process and full system build relationships.

  • Water Washing

    To remove resin and flux residues from PCBAs.

  • Wave Soldering

    Lead and Lead-Free wave solder processes are available.

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